Téléchargez le livre : Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits



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Éditeur :

Springer


Collection :

Analog Circuits and Signal Processing

Paru le : 2014-08-21



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Description
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Pages
179 pages
Collection
Analog Circuits and Signal Processing
Parution
2014-08-21
Marque
Springer
EAN papier
9783319076102
EAN EPUB
9783319076119
Informations sur l'ebook
Nombre pages copiables
1
Nombre pages imprimables
17
Taille du fichier
3881 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
94,94 €

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