Téléchargez le livre : Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Effects of Temperature, Moisture and Mechanical Driving Forces

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Éditeur :

Woodhead Publishing


Paru le : 2015-05-23



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Description
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study
Pages
482 pages
Collection
n.c
Parution
2015-05-23
Marque
Woodhead Publishing
EAN papier
9781845695286
EAN PDF
9780857099112
Informations sur l'ebook
Nombre pages copiables
48
Nombre pages imprimables
48
Taille du fichier
25876 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
152,97 €
EAN EPUB SANS DRM
9780857099112
Informations sur l'ebook
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
152,97 €
Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia

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