Professor Cher Ming Tan obtained his PhD in Electrical Engineering from the University of Toronto in 1992. He has eight years of working experience in reliability in the electronics industry (both Singapore and Taiwan) before joining Nanyang Technological University (NTU) as a faculty member in 1996 where he stayed until 2014. He is now a Professor at Chang Gung University, Taiwan, and the Director of the Centre of Reliability Science and Technology (CReST). He has published more than 400 international journal and conference papers and holds 14 patents and 1 copyright for reliability software. He has given more than 100 keynote and invited talks at international conferences. He has written 6 books and 4 book chapters in the field of reliability. He is the Series Editor of Springer Briefs in Reliability, Editor of Scientific Reports, Editor of IEEE Transactions on Materials and Device Reliability, Associate Editor of Microelectronics Reliability, and Research Editor of Frontiers in Materials. He is Fellow of the Institute of Engineers, Singapore, Fellow of the Singapore Quality Institute, and an IEEE Electron Devices Distinguished Lecturer. He is also on the technical committee for reviewing IEEE Reliability Standards 1413.1 and 1624.
Télécharger le livre :  Reliability and Failure Analysis of High-Power LED Packaging

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the...
Editeur : Woodhead Publishing
Parution : 2022-09-24

Format(s) : epub sans DRM
184,63

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Télécharger le livre :  Theory and Practice of Quality and Reliability Engineering in Asia Industry

This book discusses the application of quality and reliability engineering in Asian industries, and offers information for multinational companies (MNC) looking to transfer some of their operation and manufacturing capabilities to Asia and at the same time maintain high...
Editeur : Springer
Parution : 2017-01-20

Format(s) : PDF, ePub
210,99

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Télécharger le livre :  Electromigration Modeling at Circuit Layout Level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels....
Editeur : Springer
Parution : 2013-03-16
Collection : SpringerBriefs in Applied Sciences and Technology
Format(s) : ePub
52,74

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Télécharger le livre :  Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs...
Editeur : Springer
Parution : 2011-03-28
Collection : Springer Series in Reliability Engineering
Format(s) : ePub
94,94

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