Jiawei Zhang has 10 years of experience working in the development and implementation of advanced packages. He is currently Staff Engineer at Qualcomm, San Diego. Previously, he served as Development Senior Staff Engineer at Broadcom Corporation responsible for IC package co-design flow (Die/Package/System). He is experienced in advanced package, FCBGA, MCM, and SiP. He has published over 30 external papers, including two which won best Conference Paper Awards (2012 IMAPS and 2014 SMTAI) He has been honored with one Broadcom Corporation Outstanding Technical Achievement Awards for design flow. He also served on the IWLPC Technical Committee from 2013 to 2015 and as the session Chair in 2013.
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Télécharger le livre : Proceedings of the 5th Chinese Conference on High Voltage and Discharge Plasmas
Jiawei Zhang , Yongdong Li , Anbang Sun , Ming Xu
Proceedings of the 5th Chinese Conference on High Voltage and Discharge Plasmas
This book presents articles from the 5th Chinese Conference on High Voltage and Discharge Plasmas, held in Xi'an, China by the Special Committee on Plasma and Its Applications of the Chinese Electrotechnical Society from November 29 to December 1, 2024. It facilitates...
Editeur : Springer
Parution : 2025-09-30

Format(s) : PDF, ePub
158,24 €
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Télécharger le livre : Encapsulation Technologies for Electronic Applications
Haleh Ardebili , Jiawei Zhang , Michael G. Pecht
Encapsulation Technologies for Electronic Applications
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It...
Editeur : William Andrew
Parution : 2018-10-23

Format(s) : epub sans DRM
216,27 €
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