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Télécharger le livre : Advanced Interconnects for ULSI Technology
Mikhail Baklanov , Paul S. Ho , Ehrenfried Zschech
Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion...
Editeur : Wiley
Parution : 2012-02-17

Format(s) : PDF, ePub
186,68 €
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Télécharger le livre : Dielectric Films for Advanced Microelectronics
Mikhail Baklanov , Martin Green , Karen Maex
Dielectric Films for Advanced Microelectronics
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced,...
Editeur : Wiley
Parution : 2007-04-04
Collection : Wiley Series in Materials for Electronic & Optoelectronic Applications
Format(s) : PDF
263,70 €
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